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Semiconductor Engineering
3 天
Chip Industry Week In Review
Synopsys’ optical biz sale to Keysight; Intel’s turnaround plan; $3B Secure Enclave funding; ADI/Tata alliance; imec’s solid-state li batteries; die dimensions challenge assembly processing; CXL; ...
Semiconductor Engineering
3 天
InRak Kim
The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical ...
Semiconductor Engineering
3 天
New Materials Are in High Demand
Development methodologies combine old and new techniques, but getting any new material into high-volume manufacturing is a ...
Semiconductor Engineering
3 天
Managing EMI in High-Density Integration
Controlling interference in today’s SoCs and advanced packaging requires a combination of innovative techniques, but new ...
Semiconductor Engineering
3 天
How Die Dimensions Challenge Assembly Processes
Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...
Semiconductor Engineering
3 天
Smart Manufacturing, Smart Data-AI, And Future Of Computing
In the last decade, the use of ML/AI exploded in the areas of speech recognition, facial recognition, smart phone features, ...
Semiconductor Engineering
4 天
Improving The Air-Stability and NBTI Reliability of BEOL CNFETs
A new technical paper titled “Overcoming Ambient Drift and Negative-Bias Temperature Instability in Foundry Carbon Nanotube Transistors” was published by researchers at MIT, Stanford University, ...
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