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Semiconductor Engineering
3 天
Smart Manufacturing, Smart Data-AI, And Future Of Computing
In the last decade, the use of ML/AI exploded in the areas of speech recognition, facial recognition, smart phone features, ...
Semiconductor Engineering
3 天
How Die Dimensions Challenge Assembly Processes
Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...
Semiconductor Engineering
5 天
CXL Thriving As Memory Link
Compute Express Link is built on a PCI Express foundation and supported by nearly all the major chip companies. It is used to ...
Semiconductor Engineering
4 天
What Comes After HBM For Chiplets
The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What ...
Semiconductor Engineering
3 天
New Materials Are in High Demand
Development methodologies combine old and new techniques, but getting any new material into high-volume manufacturing is a ...
Semiconductor Engineering
3 天
Managing EMI in High-Density Integration
Controlling interference in today’s SoCs and advanced packaging requires a combination of innovative techniques, but new ...
Semiconductor Engineering
6 天
Achieving Zero Defect Manufacturing Part 3: Prevention Of Defects
How to detect dormant defects, use feedback and feedforward measures, and monitor the health of process control equipment.
Semiconductor Engineering
10 天
Scalable Fabrication of Graphene FETs on Non-Planar Surfaces (Imperial College London)
A new technical paper titled “Fabrication of graphene field effect transistors on complex non-planar surfaces” was published ...
Semiconductor Engineering
5 天
Research Bits: Sept. 17
Researchers from North Carolina State University, Pohang University of Science and Technology, Ulsan National Institute of ...
Semiconductor Engineering
4 天
Blog Review: Sept. 18
Hurricane forecasting for semiconductors; Display Stream Compression; growing the photonics ecosystem; container runtime for ...
Semiconductor Engineering
12 天
Standardizing Defect Coverage In Analog/Mixed Signal Test
IEEE P2427 is poised to be the cornerstone in the testing and validation of AMS designs; full industry support is still ...
Semiconductor Engineering
3 天
InRak Kim
The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical ...
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